Abstract
In this study, copper alloy matrix composites reinforced with WC particles with the addition of different Ni contents (0, 3, 5, 7, and 10 wt.%) were prepared by the spontaneous infiltration process. Image analysis was used to quantify the microstructural parameters, such as the particle size and distribution, area fraction, binder mean free path, pore size and porosity. The effect of Ni addition on the microstructure, density and hardness are discussed. The results show that a small addition of Ni improves the densification of the infiltrated composites. The quantitative analysis results are in good agreement with the microstructure properties and hardness results.
References
A. Mortensen and J. Llorca, Annu. Rev. Mater. Res, 40 (2010) 243-270.
B. Cantor, F. P. Dunne, and I. C. Stone, Metal and ceramic matrix composites, CRC Press, 2003.
I. Chang and Y. Zhao, Advances in Powder Metallurgy: Properties, Processing and Applications, Elsevier, 2013.
T. Clyne, An introductory overview of MMC systems, types, and developments, Comprehensive composite materials, Elsevier, 2000, 1-26.
S. Suresh, Fundamentals of metal-matrix composites, Elsevier, 2013.
N. Natarajan, V. Krishnaraj, and J. P. Davim, Metal matrix composites: synthesis, wear characteristics, machinability study of MMC brake drum, Springer, 2014.
M. Reyes and A. Neville, Wear, 255 (2003) 1143-1156.
K. Kembaiyan and K. Keshavan, Wear, 186 (1995) 487-492.
E. Hong, B. Kaplin, T. You, M.-s. Suh, Y.-S. Kim, and H. Choe, Wear, 270(9) (2011) 591-597.
P. Deshpande and R. Lin, Mater. Sci. Eng., A, 418(1) (2006) 137-145.
M. Yusoff, R. Othman, and Z. Hussain, Mater. Desi., 32(6) (2011) 3293-3298.
J. Liu, S. Yang, W. Xia, X. Jiang, and C. Gui, J. Alloy. Compd., 654 (2016) 63-70.
L. Wojnar, Image analysis: applications in materials engineering, Crc Press, 1998.
Wojnar, Leszek, Krzysztof J. Kurzydlowski, and Janusz Szala. Mater. Park., OH: ASM Inter., (2004) 403-427.
J. J. Friel, Practical guide to image analysis, ASM international, 2000.
M. Charpentier, A. Hazotte, and D. Daloz, Mater. Sci. Eng., A, 491(1) (2008) 321-330.
H. E. Exner, Image Anal. Stereol., 23(2) (2011) 73-82.
J. Shen, L. Campbell, P. Suri, and R. M. German, Int. J. Refract. Metals. Hard. Mater., 23 (2005) 99-108.
A. Petersson and J. Ågren, Acta Mater., 53 (2005) 1673–1683.
O. Dengiz, R. McAfee, I. Nettleship, and A. E. Smith, J. Eur. Ceram. Soc., 27 (2007) 1927-1933.
A. M. Gokhale, Microsc. Microanal., 22 (2016) 1966-1967.
M. Coster, X. Arnould, J. Chermant, L. Chermant, and T. Chartier, J. Eur. Ceram. Soc., 25 (2005) 3427-3435.
V. Michaud and A. Mortensen, Composites Part A, 32 (2001) 981-996.
A. Mortensen, Melt infiltration of metal matrix composites, Comprehensive composite materials, Elsevier, 2000, 521-554.
N. Eustathopoulos, A. Mortensen, and S. Suresh, Capillary phenomena, interfacial bonding and reactivity, Butterworths,1993.
J. Fridlyander, Metal matrix composites, Springer Science & Business Media, 2012.
A. Léger, L. Weber, and A. Mortensen, J. Mater. Sci., 49 (2014) 7669-7678.
V. Silva, C. Fernandes, and A. Senos, Ceram. Int., 42(1) (2016) 1191-1196.
H. De Macedo, A. Da Silva, and D. de Melo, Mater. Lett., 57(24) (2003) 3924-3932.
O. M. Alzouma, M.-A. Azman, D.-L. Yung, V. Fridrici, and P. Kapsa, Wear, 352 (2016) 130-135.
Y. Xu, Z. Yang, Z. Han, G. Liu, and J. Li, Ceram. Int., 40(1) (2014) 1037-1043.
N. Lin, Y. Jiang, D. Zhang, C. Wu, Y. He, and D. Xiao, Int. J. Refract. Metals. Hard. Mater., 29(4) (2011) 509-515.
K. Eun, D. Kim, and D. Yoon, Powder metall., 27(2) (1984) 112-114.
X. Zhang, J. Zhou, N. Lin, K. Li, K. Fu, B. Huang, and Y. He, Int. J. Refract. Metals. Hard. Mater., 57 (2016) 64-69.
Anon, Standard Test Methods for Density of Compacted or Sintered Powder Metallurgy (PM) Products Using Archimedes’ Principle. 2008, ASTM International.
Anon, Standard Test Methods for Vickers Hardness and Knoop Hardness of Metallic Materials. 2017, ASTM International.
S. Ren, X. He, X. Qu, and Y. Li, J. Alloy. Compd., 455 (2008) 424-431.
F. Akhtar, S. J. Askari, K. A. Shah, X. Du, and S. Guo, Mater. Charact., 60(4) (2009) 327-336.
P. Deshpande, J. Li, and R. Lin, Mater. Sci. Eng., A, 429(1) (2006) 58-65.
H.-C. Kim, I.-J. Shon, J.-K. Yoon, J.-M. Doh, and Z. A. Munir, Int. J. Refract. Metals. Hard. Mater., 24(6) (2006) 427-431.
N. Ray, B. Kempf, T. Mützel, F. Heringhaus, L. Froyen, K. Vanmeensel, and J. Vleugels, J. Alloy. Compd., 670 (2016) 188-197.
Authors retain copyright of the published papers and grant to the publisher the non-exclusive right to publish the article, to be cited as its original publisher in case of reuse, and to distribute it in all forms and media.
The Author(s) warrant that their manuscript is their original work that has not been published before; that it is not under consideration for publication elsewhere; and that its publication has been approved by all co-authors, if any, as well as tacitly or explicitly by the responsible authorities at the institution where the work was carried out. The Author(s) affirm that the article contains no unfounded or unlawful statements and does not violate the rights of others. The author(s) also affirm that they hold no conflict of interest that may affect the integrity of the Manuscript and the validity of the findings presented in it. The Corresponding author, as the signing author, warrants that he/she has full power to make this grant on behalf of the Author(s). Any software contained in the Supplemental Materials is free from viruses, contaminants or worms.The published articles will be distributed under the Creative Commons Attribution ShareAlike 4.0 International license (CC BY-SA).
Authors are permitted to deposit publisher's version (PDF) of their work in an institutional repository, subject-based repository, author's personal website (including social networking sites, such as ResearchGate, Academia.edu, etc.), and/or departmental website at any time after publication.
Upon receiving the proofs, the Author(s) agree to promptly check the proofs carefully, correct any typographical errors, and authorize the publication of the corrected proofs.
The Corresponding author agrees to inform his/her co-authors, of any of the above terms.